Advantages and disadvantages of multilayer immersion gold PCB from buzai232's blog

In order to get into the electronic products we need to understand the circuit board, IC, MCU, CPU, chip production process, in deepening its understanding.

Circuit board (Printed Circuit Board, referred to as PCB), also known as PCB, PCB board, circuit boards, etc., is an important electronic components, is the support of electronic components, is the electrical component line connection provider. Traditional circuit boards, using the printing etching inhibitor of the work method, make circuits and surface, so called printed circuit boards or printed circuit boards.OEM service

IC: To achieve some kind of function, the circuit unit can be concentrated together, the English is called IC.SCM: is a minimal system, can be programmed to achieve all the needs of the function, the English is called MCU, the microcontroller, such as the use of single-chip microcomputer, and then add a variety of peripheral circuits, can make robots.CPU: Chinese call central processing Unit, is an electronic product of the heart, such as your current computer, if no CPU is dead.Chips: Abbreviations for integrated circuits.

Multilayer immersed Gold circuit board for each electronic product field, is an indispensable component of electronic products. Electronic components will be installed welding on the circuit board to achieve its functional value. The most commonly used process is tin or nickel gold, now mainly to introduce the role of nickel gold and advantages and disadvantages.
First, the sinking gold process is covered in the plate welding plate, as an important part, must be because nickel gold is very easy to solder together with tin one of the materials, and nickel gold can also play the protective pad copper skin will not be oxidized by air, corrosion, play to protect the role of the circuit board, in addition to the nickel gold process is now in line with the promotion of the environmental requirements of various countries, immersion gold process is unleaded process (lead-free multi-layer immersion gold PCB), customers can be assured of the use of production. In addition, multi-layer sinking gold circuit board process because it is chemical sinking gold, so covering the surface of the solder plate is flat, so it is also very easy to weld, especially now many high-precision PCB, processing requirements are very high, if the welding bad caused the virtual welding, BGA is not so easy to find the reason, causing engineers to adjust repeatedly is also troublesome, so multi-layer circuit board sinking Gold technology, generally can be very good to avoid this phenomenon, so now many precision circuit boards are using the immersion gold process to do only.
But the sinking gold craft also has a little shortcoming, that is the cost will be more expensive than the general craft. As the company's cost consideration, generally not very precise or demanding boards, can choose to spray lead tin or lead-free tin.

Previous post     
     Next post
     Blog home

The Wall

No comments
You need to sign in to comment